The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2026

Filed:

Feb. 21, 2022
Applicant:

Horiba, Ltd., Kyoto, JP;

Inventors:

Yusuke Awane, Kyoto, JP;

Makoto Matsuhama, Kyoto, JP;

Kosuke Tsukatani, Kyoto, JP;

Kodai Niina, Kyoto, JP;

Takuya Ido, Kyoto, JP;

Assignee:

HORIBA, LTD., , JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/31 (2006.01); G01N 33/00 (2006.01); H01S 5/022 (2021.01); H01S 5/028 (2006.01);
U.S. Cl.
CPC ...
H01S 5/028 (2013.01); G01N 21/31 (2013.01); G01N 33/0027 (2013.01); H01S 5/022 (2013.01); G01N 2201/06113 (2013.01);
Abstract

To suppress individual differences in intensity of output laser light for each semiconductor laser device as much as possible while suppressing generation of stray light in a package of the semiconductor laser device, provided is a semiconductor laser device used for optical analysis, including: a package that accommodates a semiconductor laser element therein; and a light reflection reducing member that is provided inside the package and suppresses reflection of light emitted from the semiconductor laser element, in which the light reflection reducing member is bonded to an inner surface of the package.


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