The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2026

Filed:

Apr. 29, 2024
Applicant:

City University of Hong Kong, Kowloon, HK;

Inventors:

Kwok Wa Leung, Kowloon Tong, HK;

Guangyao Liu, Kowloon Tong, HK;

Nan Yang, Guangzhou, CN;

Kwai Man Luk, Kowloon Tong, HK;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 9/04 (2006.01); H01Q 21/06 (2006.01); H01Q 9/06 (2006.01);
U.S. Cl.
CPC ...
H01Q 21/065 (2013.01); H01Q 9/0414 (2013.01); H01Q 9/0485 (2013.01); H01Q 9/065 (2013.01);
Abstract

A microstrip antenna which includes a substrate, a ground on a second side of the substrate, a first patch on a first side of the substrate, and a second patch on the first side of the substrate. The first patch is connected to a first port. The second patch is separated from the first patch and connected to a second port. Each of the first and second patches is further formed with a plurality of shorting vias connected to the ground. The radiation patterns of each element also feature the RPD characteristic, which is promising for large-scale MIMO or array antennas.


Find Patent Forward Citations

Leung, Kwok. (2026). Two-dimensional microstrip patch antennas and arrays with radiation pattern decoupling (U.S. Patent No. 12542373). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12542373

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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