The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2026
Filed:
Aug. 31, 2022
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Hyeg Soon An, Suwon-si, KR;
Hui Sun Park, Suwon-si, KR;
Jeong Wook Seo, Suwon-si, KR;
Tae Hyung Kim, Suwon-si, KR;
Hee Sun Chun, Suwon-si, KR;
Hyo Ju Lee, Suwon-si, KR;
Jin Woo Kim, Suwon-si, KR;
Seok Hyun Yoon, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer, and an external electrode disposed on the body. The dielectric layer includes a BaTiO-based base material main ingredient, a sub-ingredient including Dy, and an additive. The additive is one or more of Sm, Gd and Tb, and a content of the additive is 25 mol or more and less than 50 mol relative to 100 mol of Dy. The dielectric layer includes a plurality of dielectric grains. When an average grain size of the plurality of dielectric grains is represented by G, and an average thickness of the dielectric layer is represented by td, 1.75≤td/G≤2.23 is satisfied.