The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2026
Filed:
Oct. 05, 2022
Kobelco Research Institute, Inc., Kobe, JP;
Kazuhiko Tahara, Kobe, JP;
Ryo Usaki, Kobe, JP;
KOBELCO RESEARCH INSTITUTE, INC., Kobe, JP;
Abstract
A wafer thickness measurement device of the present invention obtains, based on: first and second interferometer reference measurement results obtained by measuring, with an A-surface optical interferometer and a B-surface optical interferometer, a reference measurement point on a reference piece having the reference measurement point at which the reference piece has a known thickness; first and second distance meter reference measurement results obtained by measuring the reference measurement point with an A-surface distance meter and a B-surface distance meter; first and second interferometer measurement results obtained by measuring a measurement point of the wafer with the A-surface optical interferometer and the B-surface optical interferometer; and first and second distance meter measurement results obtained by measuring the measurement point with the A-surface distance meter and the B-surface distance meter, and obtains a thickness, of the wafer, at the measurement point.
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