Thermosyphon cooling device with upright roll-bond fins

Abstract

The disclosure is directed to a thermosyphon cooling device having a heat-exchange plate and a plurality of roll-bond fins. An evaporation chamber is defined inside the heat-exchange plate. A heat-exchange surface and a top surface are disposed at two sides of the heat-exchange plate. A capillary structure is arranged in the evaporation chamber, and the capillary structure is corresponding to the heat-exchange surface. The roll-bond fins are arranged upright on the top surface, and a plurality of condensing chambers communicating with the evaporation chamber are defined in each of the roll-bond fins, respectively. Each of the condensing chambers communicates with each of the evaporation chambers through at least one overflow port, respectively, and a working fluid is contained in the condensing chambers. Each of the condensing chambers is extended across the at least one overflow port in a direction perpendicular to a normal line of the heat-exchange plate.