The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2026

Filed:

Jun. 29, 2021
Applicant:

Hanon Systems, Daejeon, KR;

Inventors:

Yun Jin Kim, Daejeon, KR;

Seong Hun Kim, Daejeon, KR;

Sung Je Lee, Daejeon, KR;

Hae Jun Lee, Daejeon, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25B 43/00 (2006.01); F25B 41/385 (2021.01);
U.S. Cl.
CPC ...
F25B 43/006 (2013.01); F25B 41/385 (2021.01); F25B 2400/23 (2013.01); F25B 2600/2513 (2013.01);
Abstract

The present invention provides a vapor injection module having a first expansion device that either stops or expands the flow of condensed refrigerant and sends it to a gas-liquid separator. The gas-liquid separator then separates the refrigerant into gas and liquid parts. A second expansion device allows the condensed refrigerant to pass through, expand it, or expand the liquid refrigerant from the separator.


Find Patent Forward Citations

Kim, Yun. (2026). Vapor injection module and heat pump system using same (U.S. Patent No. 12540763). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12540763

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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