The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2026

Filed:

Aug. 22, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Wei Liu, San Jose, CA (US);

Shashank Sharma, Fremont, CA (US);

Matthew Spuller, Belmont, CA (US);

Vladimir Nagorny, Tracy, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 8/36 (2006.01); C23C 8/24 (2006.01); H01J 37/32 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C23C 8/36 (2013.01); C23C 8/24 (2013.01); H01J 37/321 (2013.01); H01J 37/32449 (2013.01); H01J 37/32522 (2013.01); H01J 37/32816 (2013.01); H01L 21/02247 (2013.01); H01L 21/02252 (2013.01); H01J 2237/182 (2013.01); H01J 2237/3387 (2013.01); H01L 21/0214 (2013.01); H01L 21/0217 (2013.01); H01L 21/02181 (2013.01); H01L 21/02189 (2013.01);
Abstract

In an embodiment, a method for nitriding a substrate is provided. The method includes flowing a nitrogen-containing source and a carrier gas into a plasma processing source coupled to a chamber such that a flow rate of the nitrogen-containing source is from about 3% to 20% of a flow rate of the carrier gas; generating an inductively-coupled plasma (ICP) in the plasma processing source by operating an ICP source, the ICP comprising a radical species formed from the nitrogen-containing source, the carrier gas, or both; and nitriding the substrate within the chamber, wherein nitriding includes operating a heat source within the chamber at a temperature from about 150° C. to about 650° C. to heat the substrate; maintaining a pressure of the chamber from about 50 mTorr to about 2 Torr; introducing the ICP to the chamber; and adjusting a characteristic of the substrate by exposing the substrate to the radical species.


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