The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2026
Filed:
Mar. 22, 2024
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Atsushi Yamada, Chino, JP;
Shinobu Yokokawa, Okaya, JP;
Hirofumi Hokari, Chino, JP;
Hajime Kakishita, Shiojiri, JP;
Assignee:
SEIKO EPSON CORPORATION, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08B 3/08 (2006.01); C08J 3/00 (2006.01);
U.S. Cl.
CPC ...
C08B 3/08 (2013.01); C08J 3/005 (2013.01); C08J 2301/10 (2013.01); C08J 2367/04 (2013.01); C08J 2401/10 (2013.01); C08J 2467/04 (2013.01);
Abstract
A molding material production method according to the present disclosure includes an acylation step of conducting acylation reaction of cellulose, while irradiating, with microwaves of 0.4 GHz or more and 6.0 GHz or less, a mixture including the cellulose, an acylation agent, and a solvent, in which the solvent is an ionic liquid or a liquid including a salt, and the mixture includes the acylation agent at a ratio of 0.2 equivalents or more based on all hydroxy groups included in the cellulose.