The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2026
Filed:
Jul. 14, 2021
Applicant:
Graphic Packaging International, Llc, Atlanta, GA (US);
Inventors:
Murat Sean Mckeown, Broomfield, CO (US);
Raymond S. Kastanek, Mead, CO (US);
Assignee:
Graphic Packaging International, LLC, Atlanta, GA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/08 (2006.01); B32B 3/30 (2006.01); B32B 15/12 (2006.01); B32B 15/20 (2006.01); B32B 27/10 (2006.01); B32B 29/00 (2006.01); B65B 43/10 (2006.01); B65D 5/20 (2006.01); B65D 5/22 (2006.01); B65D 81/34 (2006.01);
U.S. Cl.
CPC ...
B65D 81/3476 (2013.01); B32B 3/30 (2013.01); B32B 15/08 (2013.01); B32B 15/12 (2013.01); B32B 15/20 (2013.01); B32B 27/10 (2013.01); B32B 29/00 (2013.01); B65B 43/10 (2013.01); B65D 5/20 (2013.01); B65D 5/2052 (2013.01); B32B 2255/12 (2013.01); B32B 2255/205 (2013.01); B32B 2307/202 (2013.01); B32B 2439/70 (2013.01); B65D 5/22 (2013.01); B65D 2581/3459 (2013.01); B65D 2581/346 (2013.01); B65D 2581/3468 (2013.01); B65D 2581/3472 (2013.01); B65D 2581/3494 (2013.01); B65D 2581/3495 (2013.01); B65D 2581/3497 (2013.01); B65D 2581/3498 (2013.01);
Abstract
A construct includes at least one panel for supporting a food product, the at least one panel formed from a laminate structure having a base layer, a conductive layer, and a surface film. The construct further includes at least one spacing feature extending downwardly from the at least one panel for supporting the at least one panel a distance above an induction source for attenuating heat transferred to the food product in response to an oscillating magnetic field interacting with the conductive layer of the laminate structure.