The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2026
Filed:
May. 23, 2023
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Tatsuya Tsuboi, Nagano, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/165 (2017.01); B29C 33/38 (2006.01); B29K 505/12 (2006.01); B29L 31/00 (2006.01); B33Y 10/00 (2015.01); B33Y 70/10 (2020.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
B29C 64/165 (2017.08); B29C 33/3842 (2013.01); B29K 2505/12 (2013.01); B29L 2031/757 (2013.01); B33Y 10/00 (2014.12); B33Y 70/10 (2020.01); B33Y 80/00 (2014.12);
Abstract
A method for manufacturing a molding die used with an injection molder, the method including plasticizing a creating material containing metal particles and resin to produce a plasticized material, and dispensing the plasticized material toward a stage to stack layers on each other to create a laminate that forms at least a portion of the molding die, with an average particle diameter Dof the metal particles being smaller than or equal to 23 μm.
Tsuboi, Tatsuya. (2026). Method for manufacturing molding die, and molding die (U.S. Patent No. 12539666). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12539666
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile