The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2026
Filed:
Oct. 08, 2021
Jsp Corporation, Tokyo, JP;
Katsunori Hisamatsu, Wako, JP;
Keiichi Hashimoto, Utsunomiya, JP;
JSP Corporation, Tokyo, JP;
Abstract
The present invention relates to a method for producing a laminate, wherein the laminate is obtained by integrally laminating an expanded beads molded article (a) composed of expanded beads A and having interconnected voids and an expanded beads molded article (b) composed of expanded particles B and having interconnected voids, the difference [P−P] between the voidage (P) of the expanded beads molded article (a) and the voidage (P) of the expanded beads molded article (b) is 5% or more, and the expanded beads A and the expanded beads B satisfy the following (1) to (3): (1) a difference [d−d] between an average hole diameter (d) of the through-holes of the expanded beads (A) and an average hole diameter (d) of the through-holes of the expanded beads (B) is 0.3 mm or more and 2 mm or less; (2) the expanded beads (B) have an average outer diameter Dof 3.5 mm or more and 5 mm or less; (3) a difference [D−D] between an average outer diameter Dof the expanded beads (A) and an average outer diameter Dof the expanded beads (B) is −0.3 mm or more and 2 mm or less.