The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2026

Filed:

Oct. 01, 2021
Applicant:

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Inventors:

Cristina Manola, Belpasso, IT;

Rosa Lucia Torrisi, Calatabiano, IT;

Simone Rascunà, Catania, IT;

Gabriele Bellocchi, Catania, IT;

Annalinda Contino, Valverde, IT;

Giuseppe Maccarrone, Calatabiano, IT;

Assignee:

STMicroelectronics S.r.l., Agrate Brianza, IT;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B22F 1/054 (2022.01); B22F 9/24 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); B22F 1/054 (2022.01); B22F 9/24 (2013.01); H01L 23/49513 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); B22F 2301/255 (2013.01); B22F 2304/054 (2013.01); H01L 23/49582 (2013.01); H01L 24/73 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83091 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/8384 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/20105 (2013.01);
Abstract

The disclosure is directed to wide band-gap semiconductor devices, such as power devices based on silicon carbide or gallium nitride materials. A power device die is attached to a carrier substrate or a base using sintered silver as a die attachment material or layer. The carrier substrate is, in some embodiments, copper plated with silver. The sintered silver die attachment layer is formed by sintering silver nanoparticle paste under a very low temperature, for example, lower than 200° C. and in some embodiments at about 150° C., and with no external pressures applied in the sintering process. The silver nanoparticle is synthesized through a chemical reduction process in an organic solvent. After the reduction process has completed, the organic solvent is removed through evaporation with a flux of inert gas being injected into the solution.


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