Method for producing an electronic component assembly on the front face of a semi-conductor wafer

Abstract

The invention concerns a method of manufacturing an assembly of electronic components () on the front surface of a semiconductor wafer () comprising a plurality of field areas (), each area () comprising at least one field () and each field () comprising at least one electronic component (). The method comprises a plurality of photolithography steps to form a stack of layers forming each electronic component (), each photolithography step comprises the application of a mask successively on each field () in photolithography equipment. One of the masks further comprises an identification pattern, said mask being called identification mask. At the photolithography step associated with the identification mask, as least one photolithographic parameter of the photolithography equipment is different for each field area (), to expose the identification pattern differently in each field area ().