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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12538789 B1

PDFFull Text
Date of Patent:
Jan. 27, 2026

Filed:

Mar. 07, 2023

Shielded ball-out and via patterns for land grid array (lga) devices

Applicant:

Marvell Israel (M.i.s.l) Ltd., Yokneam, IL;

Inventors:

Dan Azeroual, Kiryat Ata, IL;

Liav Ben Artsi, Nahariya, IL;

David Katz, Hadera, IL;

Assignee:

Marvell Asia Pte Ltd, Singapore, SG;

Attorneys:

Meitar Patents Ltd.

Daniel Kligler

Primary Examiner:

Marcos D Pizarro

Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 23/498 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 24/04 (2013.01); H05K 1/113 (2013.01); H05K 3/3436 (2013.01); H01L 2224/0502 (2013.01); H01L 2924/15 (2013.01);
Abstract

An electronic network device includes a package substrate, an Integrated Circuit (IC) mounted on the package substrate, and a plurality of interconnection terminals disposed on a surface of the package substrate. The interconnection terminals include multiple pairs of signal terminals and multiple ground terminals. The interconnection terminals are arranged in a hexagonal grid in which (i) a given interconnection terminal is surrounded by six other interconnection terminals, and (ii) propagation paths between signal terminals that do not belong to a same pair are at least partially blocked by the ground terminals.

Find Patent Forward Citations

Azeroual, Dan. (2026). Shielded ball-out and via patterns for land grid array (lga) devices (U.S. Patent No. 12538789). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12538789

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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