The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2026

Filed:

Oct. 24, 2022
Applicants:

Chuzhou Hkc Optoelectronics Technology Co., Ltd., Chuzhou, CN;

Hkc Corporation Limited, Shenzhen, CN;

Inventors:

Tianhui Qiu, Chuzhou, CN;

Baohong Kang, Chuzhou, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); G02F 1/1362 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76894 (2013.01); G02F 1/136263 (2021.01);
Abstract

Disclosed are a method and a device for repairing a circuit on an array substrate, and an array substrate. The method includes: determining a section to be repaired on each signal line; applying a conductive material to form a repair line between two ends of the section to be repaired, the repair line being connected with two ends of the section to be repaired; and applying an insulating material to form a cover layer above the repair line, the cover layer completely covers the surface of the repair line.


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Qiu, Tianhui. (2026). Method and device for repairing circuit on array substrate, and array substrate (U.S. Patent No. 12538772). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12538772

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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