The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2026
Filed:
Dec. 08, 2022
Hrl Laboratories, Llc, Malibu, CA (US);
Partia Naghibi Mahmoudabadi, Malibu, CA (US);
Chiaming Chang, Malibu, CA (US);
HRL LABORATORIES, LLC, Malibu, CA (US);
Abstract
A bond tool for bonding ultra-thin substrates includes: a mesh pattern comprising a plurality of micro grooves having a depth in a range of 1 to 10 um; a plurality of front-side vias in a center portion of the mesh pattern and having a depth in a range of 100 to 200 um; and a back-side via connected to the plurality of front-side vias. A method of manufacturing a bond tool for bonding ultra-thin substrates includes: providing a substrate comprising a top layer, a bottom layer, and an etch stop layer between the top layer and the bottom layer; etching the top layer to form a mesh pattern comprising a plurality of micro grooves and a plurality of micro pedestals between the plurality of micro grooves; etching a plurality of front-side vias in the top layer; and etching back-side via in the bottom layer to align with and connect to the front-side vias.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile