Sequencing chip and manufacturing method therefor

Abstract

Provided are a chip matrix, a sequencing chip, and a manufacturing method thereof. The chip matrix includes: a wafer layer (), the wafer layer () having cutting lines that are evenly distributed thereon; a first silicon oxide layer (), the first silicon oxide layer () being made of silicon oxide and formed on an upper surface of the wafer layer (); a transition metal oxide layer (), the transition metal oxide layer () being made of transition metal oxide and formed on an upper surface of the first silicon oxide layer (). The chip matrix has characteristics such as resistances against high temperature, high humidity and other harsh environments. Meanwhile, by changing pH, surfactant and other components of a solution containing sequences to be sequenced, a surface functional region of the chip matrix can specifically adsorb a sequence to be sequenced.