The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2026

Filed:

Feb. 21, 2022
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Tao Wang, Beijing, CN;

Mengyang Wen, Beijing, CN;

Ziyu Zhang, Beijing, CN;

Tao Sun, Beijing, CN;

Yue Cui, Beijing, CN;

Chengjie Qin, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 59/122 (2023.01); H10K 59/35 (2023.01);
U.S. Cl.
CPC ...
H10K 59/122 (2023.02); H10K 59/353 (2023.02);
Abstract

An array substrate is provided. The array substrate includes a base substrate; an auxiliary structure in an inter-subpixel region and on the base substrate; and a cathode layer on a side of the auxiliary structure away from the base substrate. The auxiliary structure includes a plurality of groups of auxiliary blocks, a respective group of the plurality of groups of auxiliary blocks including one or more auxiliary blocks protruding away from the base substrate. The plurality of groups of auxiliary blocks are configured to enhance adhesion between an organic layer and an adjacent layer and reduce or eliminate interlayer peeling therebetween.


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