The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2026

Filed:

Sep. 16, 2022
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Chueh-Yuan Nien, Miao-Li County, TW;

Chao-Chin Sung, Miao-Li County, TW;

Chao-Sen Yang, Miao-Li County, TW;

Chien-Tzu Chu, Miao-Li County, TW;

Yu-Chien Kao, Miao-Li County, TW;

Li-Wei Sung, Miao-Li County, TW;

Assignee:

INNOLUX CORPORATION, Miao-Li County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 30/67 (2025.01); H10D 30/01 (2025.01);
U.S. Cl.
CPC ...
H10D 30/6758 (2025.01); H10D 30/031 (2025.01);
Abstract

A method of manufacturing an electronic device is provided. The method includes the following steps: providing a substrate; forming a thin-film transistor layer on the substrate; forming a first passivation layer on the substrate; forming an organic layer on the substrate; patterning the organic layer to expose a first region; forming a second passivation layer on the substrate; patterning the first passivation layer to expose a second region; forming a bonding pad on the substrate, wherein the bonding pad corresponds to an overlapping area of the first region and the second region; and bonding an electronic component to the bonding pad. An electronic device manufactured by the method is also provided.


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