The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2026

Filed:

Sep. 13, 2023
Applicant:

Amd Design, Llc, Wilmington, DE (US);

Inventor:

Ting Yu Lin, Fairfield, NJ (US);

Assignee:

AMD Design, LLC, Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20309 (2013.01); H05K 7/20327 (2013.01);
Abstract

A thermosiphon is provided for a computing system. The thermosiphon includes an evaporating portion and a pool portion. The evaporating portion is operable to be in thermal communication with a computing component of the computing system. The evaporating portion is operable to retain an evaporating volume of fluid to lower a temperature of the computing component. The pool portion is in fluid communication with the evaporating portion. The pool portion is operable to receive excess fluid of the fluid from the evaporating portion when a volume of the fluid in the evaporating portion is greater than the evaporating volume.


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Quick Actions:

Lin, Ting. (2026). Thermosiphon for computing components (U.S. Patent No. 12538453). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12538453

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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