The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2026

Filed:

Apr. 12, 2023
Applicant:

Stats Chippac Pte. Ltd., Singapore, SG;

Inventors:

Kyowang Koo, Incheon, KR;

Kicheol Lee, Incheon, KR;

Bolee Lim, Incheon, KR;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/12 (2006.01); B23K 37/06 (2006.01); H01L 23/00 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/1225 (2013.01); B23K 37/06 (2013.01); H01L 24/83 (2013.01); B23K 2101/42 (2018.08); H01L 2224/83192 (2013.01); H01L 2224/83815 (2013.01);
Abstract

A stencil mask and a stencil printing method are provided. The stencil mask includes: a non-reinforcement portion having a mask surface configured to contact a substrate surface of a substrate; and a reinforcement portion having a thickness greater than that of the non-reinforcement portion, wherein the reinforcement portion includes: an embossed surface for insertion into a cavity of the substrate and configured to contact a cavity bottom surface when the stencil mask is placed onto the substrate for stencil printing; and at least one first stencil window that allows the fluid material to flow through the reinforcement portion, wherein the at least one first stencil window is aligned with at least one printing region within the cavity when the stencil mask is placed onto the substrate for stencil printing.


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