The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2026

Filed:

May. 26, 2022
Applicants:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Sumitomo Electric Printed Circuits, Inc., Shiga, JP;

Inventors:

Masamichi Yamamoto, Osaka, JP;

Kayo Hashizume, Osaka, JP;

Issei Okada, Osaka, JP;

Kenichiro Aikawa, Shiga, JP;

Yoshio Oka, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/10 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/107 (2013.01); H05K 1/0346 (2013.01); H05K 1/09 (2013.01); H05K 3/181 (2013.01); H05K 3/188 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/2081 (2013.01);
Abstract

A printed wiring board includes a base film having a first major surface provided with a groove, and a wiring line disposed in the groove. The wiring line includes a metal particle layer disposed at least on a bottom surface of the groove and a plating layer disposed on the metal particle layer. The metal particle layer contains a plurality of metal particles bonded to each other by metallic bonding. A surface of each of the plurality of metal particles is partially coated with an organic film.


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