The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2026
Filed:
Jan. 24, 2023
Simmonds Precision Products, Inc., Vergennes, VT (US);
Jeffrey Ewanchuk, Manchester, CT (US);
Paul Martin Franz, Shelburne, VT (US);
Christopher Fitzhugh, Essex Junction, VT (US);
Scott R. Durkee, New Haven, VT (US);
Simmonds Precision Products, Inc., Vergennes, VT (US);
Abstract
A circuit board assembly can include a circuit component die, a first dielectric layer disposed on a first side of the circuit component die made of a first dielectric material having a high thermal conductivity, a second dielectric layer disposed on a second side of the circuit component die made of the first dielectric material, and a bulk dielectric material having a lower thermal conductivity than the first dielectric material. The bulk dielectric material can have a lower glass transition temperature than the first dielectric material and being heterogeneous to the first dielectric material. The bulk dielectric material can be in flowed contact with lateral sides of the circuit component die, the first dielectric layer, and the second dielectric layer to laterally enclose the circuit component die, the first dielectric layer, and the second dielectric layer.