The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2026
Filed:
Sep. 26, 2023
Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd., Hebei Province, CN;
Avary Holding (Shenzhen) Co., Ltd., Shenzhen, CN;
Garuda Technology Co., Ltd., New Taipei, TW;
Xiao-Long Huang, Hebei Province, CN;
Yu-Jia Men, Hebei Province, CN;
GARUDA TECHNOLOGY CO., LTD., New Taipei, TW;
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD., Hebei Province, CN;
AVARY HOLDING (SHENZHEN) CO., LTD, Shenzhen, CN;
Abstract
A provided circuit board includes an embedded capacitor, a substrate, and an insulating layer. The embedded capacitor includes a dielectric layer, a first electrode and a second electrode. The dielectric layer has a first side surface, a second side surface adjacent to the first side surface, a third side surface opposite to the first side surface, and a fourth side surface opposite to the second side surface. The first and second electrodes respectively cover the first and third side surfaces. The substrate surrounds the embedded capacitor and is physically connected to the second and fourth side surfaces. The first electrode is between the first side surface and a sidewall of the substrate. The insulating layer covers the embedded capacitor and the substrate and extends from an upper surface to a lower surface of the substrate along the first electrode and the sidewall of the substrate.