The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2026

Filed:

May. 23, 2022
Applicants:

Hefei Boe Ruisheng Technology Co., Ltd., Anhui, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Jiawei Xu, Beijing, CN;

Zouming Xu, Beijing, CN;

Xintao Wu, Beijing, CN;

Yajun MA, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/538 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
H05K 1/0219 (2013.01); H01L 23/5383 (2013.01); H05K 1/0274 (2013.01); H05K 1/111 (2013.01); H01L 25/167 (2013.01); H05K 1/0224 (2013.01); H05K 1/11 (2013.01); H05K 1/18 (2013.01);
Abstract

The present disclosure provides a wiring substrate and an electronic apparatus. The wiring substrate includes a substrate and a shielding signal line disposed on the substrate. The substrate includes a functional region; the functional region is provided with a plurality of pad groups; the plurality of pad groups are distributed in an array along a first direction and a second direction respectively, and the second direction intersects with the first direction. The shielding signal line includes a first portion surrounding all pad groups and second portions connected with the first portion, and the second portions are located between two adjacent pad groups along the second direction. The electronic apparatus includes the wiring substrate and an electronic element connected with the pad groups.


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