The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2026

Filed:

May. 25, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Youngho Yoon, Suwon-si, KR;

Sangchul Jung, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/367 (2006.01); H01L 23/427 (2006.01); H01L 23/467 (2006.01); H05K 7/20 (2006.01); G06F 1/16 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H01L 23/3677 (2013.01); H01L 23/427 (2013.01); H01L 23/467 (2013.01); H05K 7/20145 (2013.01); H05K 7/20209 (2013.01); G06F 1/163 (2013.01); G06F 1/203 (2013.01);
Abstract

An electronic device is provided. The electronic device includes a printed circuit board (PCB) comprising a first surface and a second surface opposite to the first surface. The electronic device includes a processor on the second surface. The electronic device includes a heat sink on the second surface, partially contacted on the processor. The electronic device includes a first integrated circuit (IC) on the first surface. The electronic device includes a second IC on the first surface spaced apart from the first IC. The electronic device includes a heat pipe including a first portion surrounding the first IC and the second IC when viewing the first surface in a second direction opposite to a first direction that the first surface faces, and a second portion extended from the first portion to the heat sink.


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