The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2026

Filed:

May. 27, 2022
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Yanling Han, Beijing, CN;

Wenqu Liu, Beijing, CN;

Qi Yao, Beijing, CN;

Lei Wang, Beijing, CN;

Hua Huang, Beijing, CN;

Zhuo Li, Beijing, CN;

Yonggang Cao, Beijing, CN;

Yue Gou, Beijing, CN;

Yaqian Ji, Beijing, CN;

Qianyan Li, Beijing, CN;

Yingzi Wang, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 7/10 (2006.01); H04R 31/00 (2006.01);
U.S. Cl.
CPC ...
H04R 7/10 (2013.01); H04R 31/003 (2013.01);
Abstract

Provides are an ultrasonic transducer, a fabrication method thereof and an electronic device. The ultrasonic transducer includes: an array substrate having a groove, a bottom electrode and an insulation layer, wherein an orthographic projection of the groove on the array substrate is within an orthographic projection of the bottom electrode on the array substrate, and the insulation layer covers the bottom electrode; and an opposite substrate, the opposite substrate and the array substrate are oppositely arranged and are attached to each other, the opposite substrate and the array substrate form a cavity in the groove, the opposite substrate has a top electrode and a vibrating diaphragm layer which are arranged in stack, and an orthographic projection of the top electrode on the array substrate is within the orthographic projection of the bottom electrode on the array substrate.


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