The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2026
Filed:
Dec. 28, 2021
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventors:
Won Seob Shin, Seoul, KR;
Tae Young Kim, Seoul, KR;
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 23/54 (2023.01); H04N 23/51 (2023.01); H04N 23/52 (2023.01); H04N 23/57 (2023.01);
U.S. Cl.
CPC ...
H04N 23/54 (2023.01); H04N 23/51 (2023.01); H04N 23/52 (2023.01); H04N 23/57 (2023.01);
Abstract
A camera module according to an embodiment includes a circuit board including a cavity; a reinforcing plate including a first region corresponding to the cavity and a second region in which the circuit board is disposed; a wire part disposed in the first region of the reinforcing plate; and an image sensor disposed on the wire part, wherein a lower surface of the image sensor is in direct contact with the wire part, and wherein the wire part and the image sensor are electrically separated from each other.