The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2026
Filed:
Feb. 28, 2024
Canon Kabushiki Kaisha, Tokyo, JP;
Yusuke Hirano, Kanagawa, JP;
CANON KABUSHIKI KAISHA, Tokyo, JP;
Abstract
An imaging device includes: a casing; an image sensor circuit board housed in the casing and configured such that an image sensor is mounted; a lens unit provided on a light reception surface side of the image sensor and connected to the image sensor circuit board so that the image sensor is housed; an image sensor circuit board heat dissipation unit provided on an opposite side to the light reception surface side of the image sensor circuit board and exposed to outside of the casing; an image sensor heat transmission member configured to transmit heat from the image sensor circuit board to the image sensor circuit board heat dissipation unit; a main circuit board housed in the casing and configured such that an electronic component is mounted; a main circuit board heat transmission member configured to transmit heat from the main circuit board to a main circuit board heat dissipation unit exposed to the outside of the casing; and a heat isolation unit disposed between the image sensor circuit board heat dissipation unit and the main circuit board heat dissipation unit to restrain heat transmission between the image sensor circuit board heat dissipation unit and the main circuit board heat dissipation unit. The heat isolation unit is formed of a material with lower heat conductivity than materials of the image sensor circuit board heat dissipation unit and the main circuit board heat dissipation unit.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile