The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2026

Filed:

Sep. 25, 2023
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Kiyoshi Aikawa, Nagaokakyo, JP;

Takanori Uejima, Nagaokakyo, JP;

Hiromichi Kitajima, Nagaokakyo, JP;

Takashi Yamada, Nagaokakyo, JP;

Yoshihiro Daimon, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/38 (2015.01); H03F 1/56 (2006.01); H03F 3/24 (2006.01);
U.S. Cl.
CPC ...
H04B 1/38 (2013.01); H03F 1/565 (2013.01); H03F 3/245 (2013.01); H03F 2200/222 (2013.01); H03F 2200/387 (2013.01);
Abstract

A radio frequency module includes a first module substrate that has a first main surface facing a second main surface, a second module substrate that has a third main surface facing a fourth main surface. The third main surface faces the second main surface. Multiple electronic components are disposed between the second main surface and the third main surface, on the first main surface, and on the fourth main surface. A first inductor is disposed in the first module substrate. The multiple electronic components include a first filter, and a switch that connects and disconnects an antenna connection terminal and the first filter. The first inductor is connected between the switch and the first filter. The first module substrate is thicker than the second module substrate.


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