The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2026

Filed:

Sep. 22, 2023
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Syunsuke Kido, Nagaokakyo, JP;

Takanori Uejima, Nagaokakyo, JP;

Naru Morito, Nagaokakyo, JP;

Masanari Miura, Nagaokakyo, JP;

Yukiya Yamaguchi, Nagaokakyo, JP;

Takuma Kuroyanagi, Nagaokakyo, JP;

Tomomi Yasuda, Nagaokakyo, JP;

Masanori Kato, Nagaokakyo, JP;

Yuuki Fukuda, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/54 (2006.01); H03F 3/24 (2006.01);
U.S. Cl.
CPC ...
H03H 9/542 (2013.01); H03F 3/245 (2013.01); H03F 2200/294 (2013.01); H03F 2200/451 (2013.01);
Abstract

A radio-frequency module includes a module substrate having main surfaces opposite to each other, a hybrid filter having a first acoustic wave resonator, a first inductor, and a first capacitor, a switch for connecting and disconnecting an antenna connection terminal and the hybrid filter, and a coupler disposed on a path linking the antenna connection terminal and the switch. The first acoustic wave resonator is disposed on the main surface, the switch is included in a semiconductor IC disposed on the main surface, the coupler is disposed inside the module substrate, and in plan view of the module substrate, the semiconductor IC at least partially overlaps the first acoustic wave resonator, and the semiconductor IC and the coupler at least partially overlaps.


Find Patent Forward Citations

Kido, Syunsuke. (2026). Radio-frequency module and communication device (U.S. Patent No. 12537511). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12537511

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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