The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2026
Filed:
Oct. 06, 2023
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventor:
Arvinder Manmohan Singh Chadha, San Jose, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01T 23/00 (2006.01); H02N 13/00 (2006.01); H05K 7/20 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H02N 13/00 (2013.01); H05K 7/20009 (2013.01); H01L 21/6833 (2013.01);
Abstract
A substrate support assembly includes a first puck plate including one or more first functional elements, and a dielectric cooling plate is bonded to the first puck plate. The dielectric cooling plate includes one or more first channels for a coolant to flow therethrough, and one or more second channels for a gas to flow therethrough.
Chadha, Arvinder Manmohan Singh. (2026). Substrate support assembly with dieletric cooling plate (U.S. Patent No. 12537464). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12537464
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile