The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2026

Filed:

Jun. 01, 2021
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Kenichi Morokuma, Tokyo, JP;

Yoshiko Tamada, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02M 1/08 (2006.01); H02M 1/00 (2006.01); H02M 1/32 (2007.01);
U.S. Cl.
CPC ...
H02M 1/08 (2013.01); H02M 1/0009 (2021.05); H02M 1/325 (2021.05);
Abstract

A power semiconductor element drive adjustment circuit is provided with a difference unit to calculate a difference value between a normalized value of the differential value of the collector-emitter voltage and a normalized value of the differential value of the collector current, a comparison unit to compare the difference value with a comparison reference value, a drive control unit to generate, on the basis of a comparison result of the comparison unit, a drive adjustment signal that adjusts a drive signal for the power semiconductor element, and a drive variable circuit to output, on the basis of the drive adjustment signal, the drive signal for the power semiconductor element.


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Morokuma, Kenichi. (2026). Power semiconductor element drive adjustment circuit, power module, and power conversion device (U.S. Patent No. 12537436). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12537436

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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