The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2026

Filed:

Aug. 17, 2023
Applicant:

Realtek Semiconductor Corp., HsinChu, TW;

Inventors:

Shih-Hsin Liao, HsinChu, TW;

Rui-Hong Liu, HsinChu, TW;

Tay-Her Tsaur, HsinChu, TW;

PO-Ching Lin, HsinChu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02H 9/04 (2006.01); G06F 30/367 (2020.01);
U.S. Cl.
CPC ...
H02H 9/046 (2013.01); G06F 30/367 (2020.01);
Abstract

A method and apparatus for simulating breakdown of an electronic component are provided. The method includes: when a terminal of an equivalent circuit model receives test charges, pulling up a voltage level of a first node of the equivalent circuit model; when the voltage level of the first node reaches a first threshold, turning on a first voltage controlled switch to pull up a voltage level of a second node of the equivalent circuit model; when the voltage level of the second mode reaches a second threshold, turning on a second voltage controlled switch to pull down a voltage level of the terminal to a holding voltage level to simulate snapback breakdown of the electronic component; and turning on a third voltage controlled switch to pull down the voltage level of the second node to turn off the second voltage controlled switch, thereby simulating second breakdown of the electronic component.


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