The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2026

Filed:

Jun. 01, 2023
Applicant:

Kmw Inc., Hwaseong-si, KR;

Inventors:

Duk Yong Kim, Yongin-si, KR;

Young Chan Moon, Suwon-si, KR;

Joon Hyong Shim, Yongin-si, KR;

Sung Hwan So, Hwaseong-si, KR;

Bae Mook Jeong, Suwon-si, KR;

Min Seon Yun, Anyang-si, KR;

Kyo Sung Ji, Hwaseong-si, KR;

Chi Back Ryu, Hwaseong-si, KR;

Sung Ho Jang, Yongin-si, KR;

Jae Hong Kim, Yongin-si, KR;

Oh Seog Choi, Hwaseong-si, KR;

Yong Won Seo, Daejeon, KR;

Won Jun Park, Yongin-si, KR;

Assignee:

KMW INC., Hwaseong-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/02 (2006.01); H01Q 1/24 (2006.01); H01Q 1/42 (2006.01); H01Q 1/50 (2006.01); H01Q 15/14 (2006.01); H01Q 21/06 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/246 (2013.01); H01Q 1/02 (2013.01); H01Q 1/42 (2013.01); H01Q 1/50 (2013.01); H01Q 15/14 (2013.01); H01Q 21/061 (2013.01);
Abstract

The present disclosure relates to an antenna apparatus, and especially comprises: a main body module in which a main board is mounted; an RF module which is fixed to the front so that an intermediate outside air layer is formed between the RF module and the main body module, and in which an RF filter unit and an antenna element unit are mounted; and an amplification unit module which is disposed so as to be exposed in the intermediate outside air layer between the main body module and the RF module, and comprises an amplification unit substrate having analog amplification elements mounted thereon, wherein heat generated from heating elements mounted on the main board is dissipated through at least any one of the front and back of the main body module, and heat generated from the amplification unit module is directly dissipated through the intermediate outside air layer, and thus the advantage of enabling maximum heat dissipation performance is provided.


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