The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2026

Filed:

Dec. 14, 2023
Applicant:

Conquer Electronics Co., Ltd., New Taipei, TW;

Inventors:

Hung-Chih Chiu, New Taipei, TW;

PO-Shuo Chiu, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01H 85/06 (2006.01); H01H 85/00 (2006.01); H01H 85/143 (2006.01);
U.S. Cl.
CPC ...
H01H 85/06 (2013.01); H01H 85/0047 (2013.01); H01H 85/143 (2013.01);
Abstract

A surface mount fuse and fuse element thereof are disclosed. The fuse element has a lead-free flat fuse, a flux layer, and a porous metal layer. The porous metal layer is bonded on one surface of the lead-free flat fuse through the flux layer. A part of the flux layer penetrates into the porous metal layer through capillary action, so the flux fills the pores of the first porous metal layer to distribute on the lead-free flat fuse evenly. When overcurrent occurs in the current loop and high temperature occurs, the flux layer helps the porous metal layer and the lead-free flat fuse to melt effectively, thereby interrupting the current loop in time.


Find Patent Forward Citations

Chiu, Hung-Chih. (2026). Surface mount fuse and fuse element thereof (U.S. Patent No. 12537157). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12537157

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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