The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2026
Filed:
Nov. 27, 2023
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Hyung Soon Kwon, Suwon-si, KR;
Hyoung UK Kim, Suwon-si, KR;
Han Seong Jung, Suwon-si, KR;
Ji Su Hong, Suwon-si, KR;
Hye Won Ryoo, Suwon-si, KR;
Jae Sung Park, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A multilayer electronic component includes a body including a dielectric layer and an internal electrode disposed alternately with the dielectric layer in a first direction, and an external electrode disposed on the outside of the body and connected to the internal electrode. The dielectric layer includes a first layer and a second layer stacked in the first direction, and each of the first layer and the second layer includes Ba, Ti, and Si. 1.5≤S2/S1≤3.0 is satisfied, when a molar ratio of Si to Ti included in the first layer is referred to as Si and a molar ratio of Si to Ti included in the second layer is referred to as S2.