The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2026

Filed:

Nov. 03, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Inhak Lee, Suwon-si, KR;

Jaesung Choi, Suwon-si, KR;

Sangyeop Baeck, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 5/06 (2006.01); G11C 11/412 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H10B 10/00 (2023.01);
U.S. Cl.
CPC ...
G11C 5/06 (2013.01); G11C 11/412 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H10B 10/00 (2023.02);
Abstract

An integrated circuit includes is provided. The integrated circuit includes: a plurality of bit lines spaced apart from each other along a first direction and extending in a second direction perpendicular to the first direction through a first sub-array and a second sub-array neighboring the first sub-array in the second direction. Each of the plurality of bit lines includes: a first metal wiring extending in the second direction, the first metal wiring including a first portion and a second portion that is separated from the first portion by a first cutting portion; a third metal wiring extending in the second direction, and at least partially overlapping the first metal wiring along a third direction perpendicular to the first direction and the second direction; and two bridges electrically connecting the first metal wiring to the third metal wiring.


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