The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2026

Filed:

Sep. 25, 2023
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Hithesh Hassan Lepaksha, Hyderabad, IN;

Sharath Kumar Nagilla, Hyderabad, IN;

Kalangi Fredy Sundar, Hyderabad, IN;

Raveesh Sinha, Hyderabad, IN;

Assignee:

Qualcomm Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 13/16 (2006.01); G06F 11/30 (2006.01); G06F 13/42 (2006.01);
U.S. Cl.
CPC ...
G06F 13/1689 (2013.01); G06F 11/3058 (2013.01); G06F 13/4234 (2013.01);
Abstract

Aspects relate to using memory access latency to mitigate thermal excesses in a System on a Chip (SOC). An apparatus includes a processing core, a memory, and thermal monitor configured to determine a thermal state of the processing core. A memory controller is coupled to the processing core, to the thermal monitor, and to the memory, and configured to provide the processing core with access to the memory, the memory controller further configured to delay access to the memory in response to the thermal state.


Find Patent Forward Citations

Lepaksha, Hithesh. (2026). Thermal mitigation for soc using memory access latency (U.S. Patent No. 12536112). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12536112

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…