The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2026

Filed:

Mar. 22, 2023
Applicant:

Nano and Advanced Materials Institute Limited, Hong Kong, HK;

Inventors:

Chi Ming Leung, Hong Kong, HK;

Sze Chun Yiu, Hong Kong, HK;

Chi Hin Wong, Hong Kong, HK;

Chi Ho Kwok, Hong Kong, HK;

Chenmin Liu, Hong Kong, HK;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/04 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
C09K 5/048 (2013.01); H05K 7/203 (2013.01); H05K 7/20327 (2013.01);
Abstract

An immersion cooling system includes a fluid-retaining container having space for accommodating an electronic device. A heat transfer fluid is in contact with the electronic device. A heat exchanger contacts and condenses vapor from vaporization of the heat transfer fluid. The heat transfer fluid has a thermal conductivity higher than 0.08 W mK, a dielectric constant (D) 20-40 GHz less than 3.0, and a heat of vaporization higher than 150 kJ kg, with fire retarding features, compatibility with plastics, metals, rubbers and includes a partially fluorinated compound. The improved immersion cooling system includes fluids with increased thermal conductivity and heat of vaporization while reducing fluid density and maintaining the advantages of the fluid being non-flammable, having high electrical stability and a low dielectric constant.


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