The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2026
Filed:
Nov. 25, 2020
Applicant:
Kuraray Co., Ltd., Okayama, JP;
Inventors:
Naoto Sugai, Tsukuba, JP;
Takaharu Shigematsu, Tsukuba, JP;
Assignee:
KURARAY CO., LTD., Okayama, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08K 7/14 (2006.01); C08K 3/32 (2006.01); C08K 5/56 (2006.01);
U.S. Cl.
CPC ...
C08K 7/14 (2013.01); C08K 3/32 (2013.01); C08K 5/56 (2013.01);
Abstract
Provided are a polyamide resin composition containing 100 parts by mass of a specific polyamide (A), 45 to 120 parts by mass of an inorganic fibrous reinforcing material (B), 25 to 40 parts by mass of at least one phosphinate salt (C) represented by a specific formula, and 2 to 15 parts by mass of a phosphite salt (D), the phosphinate salt (C) and the phosphite salt (D) being contained at a specific ratio, and a molded object of the polyamide resin composition.
Sugai, Naoto. (2026). Polyamide resin composition and molded object thereof (U.S. Patent No. 12534597). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12534597
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile