The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2026
Filed:
Oct. 04, 2022
Tanaka Kikinzoku Kogyo K.k., Tokyo, JP;
Hiroki Sato, Tsukuba, JP;
Yuki Fujita, Tsukuba, JP;
Teruhisa Iwai, Tsukuba, JP;
Yuusuke Ohshima, Tsukuba, JP;
Shuntaro Takahashi, Tsukuba, JP;
Shigeyuki Ootake, Tsukuba, JP;
TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd., Tokyo, JP;
Abstract
The present invention relates to a metal paste for forming a metal wiring containing a solid content of a silver particle and kneaded with a solvent. The solid content of the metal paste contains a silver particle having prescribed particle size distribution and average particle size, and using an amine compound as a protective agent. The solvent is a mixed solvent in which two organic solvents of a solvent A and a solvent B are mixed. The solvent A is dihydroterpineol or terpineol, and the solvent B is at least one organic solvent having a boiling point of 240° C. or more. The mixed solvent has a Hansen solubility parameter distance Ra from dihydroterpineol of 3.0 MPaor less. The metal paste further contains a high molecular weight ethyl cellulose as a first additive, and a polyvinyl acetal resin as a second additive.