The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2026
Filed:
Jun. 02, 2020
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Andre Brockmeier, Villach, AT;
Rafael Janski, Villach, AT;
Boris Kirillov, Judendorf-Straßenge, AT;
Marten Oldsen, Anzing, DE;
Clemens Roessler, Villach, AT;
Francisco Javier Santos Rodriguez, Villach, AT;
Sokratis Sgouridis, Annenheim, AT;
Kurt Sorschag, Villach, AT;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); B81B 7/00 (2006.01); G01S 7/481 (2006.01); G02B 26/08 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00269 (2013.01); B81B 7/0067 (2013.01); G01S 7/4817 (2013.01); G02B 26/0833 (2013.01); B81B 2201/042 (2013.01); B81B 2201/047 (2013.01); B81C 2201/036 (2013.01); B81C 2203/0118 (2013.01); B81C 2203/037 (2013.01);
Abstract
In a method of generating a microelectromechanical system, MEMS, device, a MEMS substrate including a movable element is provided. A glass cover member including a glass cover is formed by hot embossing. The glass cover member is bonded to the MEMS substrate so as to hermetically seal by the glass cover a cavity in which the movable element is arranged.