The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2026

Filed:

May. 21, 2020
Applicant:

Suzhou Precigenome Ltd, Co., Suzhou, CN;

Inventors:

Chen Li, Suzhou, CN;

Yunfeng Ling, Suzhou, CN;

Yu Liu, Suzhou, CN;

Hua Zhang, Suzhou, CN;

Yaqi Wang, Suzhou, CN;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B01L 7/00 (2006.01); B01L 3/00 (2006.01); B01L 7/04 (2010.01); B01L 9/00 (2006.01); C12Q 1/686 (2018.01);
U.S. Cl.
CPC ...
B01L 7/52 (2013.01); B01L 3/502784 (2013.01); B01L 9/527 (2013.01); C12Q 1/686 (2013.01); B01L 7/04 (2013.01); B01L 2200/0689 (2013.01); B01L 2200/10 (2013.01); B01L 2300/0819 (2013.01); B01L 2400/0487 (2013.01);
Abstract

A microfluidic chip assembly for rapidly performing digital polymerase chain reaction (PCR) and use thereof are provided. The microfluidic chip assembly includes at least one microfluidic chip, a heat sink arranged below the microfluidic chip, a heater arranged above the microfluidic chip, a semiconductor cooler arranged between the heat sink and the microfluidic chip, and a heat-conducting plate arranged above the semiconductor cooler. A thin film layer is bonded at the bottom of the microfluidic chip, and the thin film layer abuts against the heat-conducting plate.


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