The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2026
Filed:
Mar. 03, 2022
Applicant:
Abbott Cardiovascular Systems Inc., Santa Clara, CA (US);
Inventor:
Robert C. Hayzelden, Murrieta, CA (US);
Assignee:
Abbott Cardiovascular Systems Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); A61M 25/09 (2006.01); B23K 1/08 (2006.01); B21F 15/08 (2006.01); B22D 18/02 (2006.01); B22D 19/04 (2006.01); B23K 3/08 (2006.01); B23K 101/32 (2006.01); C23C 6/00 (2006.01);
U.S. Cl.
CPC ...
A61M 25/09 (2013.01); B23K 1/08 (2013.01); A61M 2025/09083 (2013.01); A61M 2025/09108 (2013.01); A61M 2025/09175 (2013.01); B21F 15/08 (2013.01); B22D 18/02 (2013.01); B22D 19/04 (2013.01); B23K 3/085 (2013.01); B23K 2101/32 (2018.08); C23C 6/00 (2013.01);
Abstract
A mold is used to form a solder joint to join the distal end of the guidewire to a wire coil. The mold has a cavity that can have different configurations so that the solder joint can be any of bullet shaped, micro-J shaped, cone shaped, truncated cone shaped, or have a textured surface.