The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2026

Filed:

Sep. 20, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Dongsoo Lim, Seoul, KR;

Chinwoo Kim, Incheon, KR;

Jeongje Moon, Seoul, KR;

Jaeyoo Jeong, Hwaseong-si, KR;

Jun Cho, Yongin-si, KR;

Yongchul Kang, Hwaseong-si, KR;

Jongwook Ju, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); G03B 15/05 (2021.01); G03B 15/06 (2021.01); H04M 1/02 (2006.01); H04M 1/22 (2006.01); H04N 23/56 (2023.01); H10F 30/10 (2025.01); H10F 77/00 (2025.01); H10H 20/856 (2025.01); H10H 20/857 (2025.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); G03B 15/05 (2013.01); G03B 15/06 (2013.01); H01L 25/165 (2013.01); H04M 1/0264 (2013.01); H04M 1/22 (2013.01); H04N 23/56 (2023.01); H10F 77/933 (2025.01); H10H 20/856 (2025.01); H10H 20/857 (2025.01); G03B 2215/0567 (2013.01); G03B 2215/0592 (2013.01); H04M 2250/52 (2013.01); H10F 30/10 (2025.01);
Abstract

A flash light emitting diode (LED) package includes a circuit board, a flash LED device disposed on an upper surface of the circuit board n, first and third optical sensors arranged to be adjacent to a first side of the flash LED device on the upper surface of the circuit board and configured to detect light of a first wavelength and light of a second wavelength, respectively, second and fourth optical sensors arranged to be adjacent to a second side of the flash LED device on the upper surface of the circuit board and configured to detect light of the first wavelength and light of the second wavelength, respectively, and an integrated circuit (IC) chip disposed to face a third side between the first and second sides of the flash LED device on the upper surface of the circuit board.


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