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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12532762 B1

PDFFull Text
Date of Patent:
Jan. 20, 2026

Filed:

Oct. 25, 2022

Dicing method

Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Tetsuro Yasukawa, Chiba, JP;

Takeshi Shibata, Kanagawa, JP;

Assignee:

Canon Kabushiki Kaisha, Tokyo, JP;

Attorney:

Venable LLP

Primary Examiner:

Thanh T Nguyen

Int. Cl.
CPC ...
H01L 23/00 (2006.01); B23K 26/38 (2014.01); B23K 26/53 (2014.01); B23K 101/40 (2006.01); B41J 2/16 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 24/94 (2013.01); B23K 26/38 (2013.01); B23K 26/53 (2015.10); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 24/32 (2013.01); B23K 2101/40 (2018.08); B41J 2/1635 (2013.01); B41J 2202/22 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/32145 (2013.01);
Abstract

A dicing method including the steps of: bonding a first wafer having a first wafer resistivity and a second wafer having a second wafer resistivity higher than the wafer first resistivity, thereby forming a bonded wafer; irradiating the bonded wafer with a laser while varying focal lengths in a thickness direction of the bonded wafer, thereby forming a plurality of modified regions along a dicing line; and dicing the bonded wafer along the dicing line by performing an expansion process on the bonded wafer formed with the modified regions.

Find Patent Forward Citations

Yasukawa, Tetsuro. (2026). Dicing method (U.S. Patent No. 12532762). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12532762

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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