The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2026
Filed:
Jan. 11, 2022
Applicant:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Inventors:
Keita Sato, Nagano, JP;
Hiroharu Yanagisawa, Nagano, JP;
Yohei Yamada, Nagano, JP;
Yuichi Nakamura, Nagano, JP;
Nobuyuki Iijima, Nagano, JP;
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); B32B 7/02 (2019.01); B32B 7/027 (2019.01); B32B 7/12 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); H01L 21/68757 (2013.01); H01L 21/68785 (2013.01); B32B 7/02 (2013.01); B32B 7/027 (2019.01); B32B 7/12 (2013.01); H01L 21/683 (2013.01);
Abstract
A substrate fixing device includes: a base plate; an electrostatic adsorption member that adsorbs and holds a substrate; and a first adhesive layer that adhesively bonds the electrostatic adsorption member to the base plate. A storage modulus of the first adhesive layer is not less than 0.01 MPa and not more than 25 MPa within a temperature range of −110° C. to 250° C.