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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12532698 B1

PDFFull Text
Date of Patent:
Jan. 20, 2026

Filed:

Dec. 05, 2022

Micro-semiconductor chip transfer apparatus and chip extraction apparatus

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Dongkyun Kim, Suwon-si, KR;

Minchul Yu, Suwon-si, KR;

Kyungwook Hwang, Seoul, KR;

Hyunjoon Kim, Seoul, KR;

Joonyong Park, Suwon-si, KR;

Seogwoo Hong, Yongin-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Eduardo A Rodela

Int. Cl.
CPC ...
H01L 21/68 (2006.01); H01L 21/67 (2006.01); H01L 21/673 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67132 (2013.01); H01L 21/67051 (2013.01); H01L 21/67333 (2013.01); H01L 21/68 (2013.01);
Abstract

A micro-semiconductor chip transfer apparatus includes: a wet chip supply module configured to supply a plurality of micro-semiconductor chips and liquid onto a transfer substrate; a chip alignment module including an absorber configured to move along a surface of the transfer substrate while absorbing the liquid; and a chip extraction module configured to extract, from the absorber, the micro-semiconductor chips remaining in the absorber.

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Quick Actions:

Kim, Dongkyun. (2026). Micro-semiconductor chip transfer apparatus and chip extraction apparatus (U.S. Patent No. 12532698). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12532698

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