The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2026

Filed:

Apr. 08, 2022
Applicant:

Quanzhou Sanan Semiconductor Technology Co., Ltd., Nanan, CN;

Inventors:

Weiping Xiong, Xiqing District, CN;

Xin Wang, Xiqing District, CN;

Zhiwei Wu, Xiqing District, CN;

Di Gao, Xiqing District, CN;

Chun-I Wu, Xiqing District, CN;

Duxiang Wang, Xiqing District, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/84 (2025.01); H10H 20/82 (2025.01);
U.S. Cl.
CPC ...
H10H 20/84 (2025.01); H10H 20/82 (2025.01);
Abstract

A flip-chip light emitting device includes a substrate, a light-emitting layer, a bonding layer disposed between the substrate and the light-emitting layer, and a protective insulating layer disposed over the light-emitting layer and the bonding layer. The bonding layer has first and second upper surfaces that respectively have different first and second roughnesses.


Find Patent Forward Citations

Xiong, Weiping. (2026). Flip-chip light emitting device and production method thereof (U.S. Patent No. 12532583). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12532583

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…